Extra Materials Archive

Book cover

Distributed Embedded Systems: Design, Middleware and Resources

IFIP 20th World Computer Congress, TC10 Working Conference on Distributed and Parallel Embedded Systems (DIPES 2008), September 7-10, 2008, Milano, Italy

© 2008

Hard cover - Print (ISBN: 978-0-387-09660-5)

Soft cover - Print (ISBN: 978-1-4419-3505-2)

Electronic (ISBN: 978-0-387-09661-2)

View this book on SpringerLink

Extra Materials File 978-0-387-09661-2