Extra Materials Archive

Book cover

Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces

© 2016

Hard cover - Print (ISBN: 978-3-662-48821-8)

Soft cover - Print (ISBN: 978-3-662-51725-3)

Electronic (ISBN: 978-3-662-48823-2)

View this book on SpringerLink