EMC for ICs > Models for EMC Simulation

Conclusion

This presentation is now completed. We detailed how an IC design methodology including EMC modeling and prediction may help saving money. We described the structure of the IC macro-model that enabled and accurate prediction of conducted/radiated emission, through a reduced set of simple elements. Then, we explained how the model can be feed with physical data at printed circuit, package, I/O and core level. We showed interesting correlation between measurements and simulation for a conducted 1ohm and TEM cell approaches, up to 1GHz. The future of EMC models, for bandwidth up to 18GHz and susceptibility have also briefly been discussed.

• EMC models can help earn/save money
• Macro-models of Ics include core modeling and package modeling
• The core model is based on current evaluation and on-chip capacitance
• The package model is based on RLC, and active I/V
• Good correlation has been achieved up to 1GHz
• Soon, requirements up to 3-10GHz