Extra Materials Archive

Book cover

Computer-Aided Innovation (CAI)

IFIP 20th World Computer Congress, Proceedings of the Second Topical Session on Computer-Aided Innovation, WG 5.4/TC 5 Computer-Aided Innovation, September 7-10, 2008, Milano, Italy

© 2008

Hard cover - Print (ISBN: 978-0-387-09696-4)

Soft cover - Print (ISBN: 978-1-4419-3519-9)

Electronic (ISBN: 978-0-387-09697-1)

View this book on SpringerLink

Extra Materials File 978-0-387-09697-1