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Book cover

Fundamentals of Lead-Free Solder Interconnect Technology

From Microstructures to Reliability

© 2015

Hard cover - Print (ISBN: 978-1-4614-9265-8)

Soft cover - Print (ISBN: 978-1-4899-7801-1)

Electronic (ISBN: 978-1-4614-9266-5)

View this book on SpringerLink