Results

Book cover

Fundamentals of Lead-Free Solder Interconnect Technology

From Microstructures to Reliability

© 2015

Hard cover - Print (ISBN: 978-1-4614-9265-8)

Electronic (ISBN: 978-1-4614-9266-5)

Soft cover - Print (ISBN: 978-1-4899-7801-1)

View this book on SpringerLink

Download Product Archive File - 978-1-4614-9266-5 Download product archive files for 978-1-4614-9266-5