Results
Fundamentals of Lead-Free Solder Interconnect Technology
From Microstructures to Reliability
© 2015
Hard cover - Print (ISBN: 978-1-4614-9265-8)
Electronic (ISBN: 978-1-4614-9266-5)
Soft cover - Print (ISBN: 978-1-4899-7801-1)
View this book on
SpringerLink
Download Product Archive File - 978-1-4614-9266-5